Kugwiritsa ntchito Copper Foil mu Chip Packaging

Chojambula chamkuwaikukhala yofunikira kwambiri pakuyika kwa chip chifukwa cha kukhathamiritsa kwake kwamagetsi, kusinthasintha kwamafuta, kusinthasintha, komanso kutsika mtengo. Nayi kusanthula kwatsatanetsatane kwakugwiritsa ntchito kwake pakuyika chip:

1. Copper Wire Bonding

• Kusintha kwa Waya Wagolide kapena Aluminium: Mwachizoloŵezi, mawaya a golidi kapena aluminiyamu akhala akugwiritsidwa ntchito popanga ma chip kuti alumikizane ndi mayendedwe amkati a chip ndi njira zakunja. Komabe, ndi kupita patsogolo kwaukadaulo wopangira mkuwa komanso kulingalira kwa mtengo, zojambula zamkuwa ndi waya wamkuwa pang'onopang'ono zikukhala zosankha zazikulu. Mayendedwe amagetsi a Copper ndi pafupifupi 85-95% ya golidi, koma mtengo wake ndi pafupifupi gawo limodzi mwa magawo khumi, ndikupangitsa kuti ikhale chisankho chabwino kwambiri pakuchita bwino komanso zachuma.
• Kukhathamiritsa kwa Magetsi: Kumangirira waya wamkuwa kumapereka kukana kocheperako komanso kukhathamiritsa kwabwino kwamatenthedwe pamapulogalamu apamwamba kwambiri komanso amakono, kumachepetsa kutayika kwamagetsi pamalumikizidwe a chip ndikuwongolera magwiridwe antchito amagetsi onse. Chifukwa chake, kugwiritsa ntchito zojambulazo zamkuwa ngati chinthu chothandizira pomangirira kumatha kukulitsa luso lazonyamula komanso kudalirika popanda kuchulukitsa mtengo.
• Amagwiritsidwa ntchito mu Electrodes ndi Micro-bumps: Pakuyika kwa flip-chip, chip chimapindika kotero kuti zolowetsa / zotulutsa (I / O) pamtunda wake zimalumikizidwa mwachindunji ndi dera pagawo la phukusi. Zojambula zamkuwa zimagwiritsidwa ntchito kupanga maelekitirodi ndi ma micro-bumps, omwe amagulitsidwa mwachindunji ku gawo lapansi. Kutsika kwamafuta otsika komanso kuthamanga kwapamwamba kwa mkuwa kumatsimikizira kufalikira kwamphamvu kwazizindikiro ndi mphamvu.
• Kudalirika ndi Kuwongolera Kutentha: Chifukwa cha kukana kwake kwa electromigration ndi mphamvu zamakina, mkuwa umapereka kudalirika kwanthawi yayitali pansi pamitundu yosiyanasiyana yamatenthedwe ndi kachulukidwe komweko. Kuphatikiza apo, kutenthetsa kwamphamvu kwa mkuwa kumathandizira kuthamangitsa kutentha komwe kumapangidwa panthawi ya tchipisi kupita ku gawo lapansi kapena sinki ya kutentha, kumapangitsa kuti phukusi lizitha kuyendetsa bwino.
• Zinthu Zotsogolera Frame: Chojambula chamkuwaimagwiritsidwa ntchito kwambiri pakuyika chimango chotsogolera, makamaka pakuyika zida zamagetsi. Choyimira chotsogolera chimapereka chithandizo chokhazikika komanso kulumikizidwa kwamagetsi kwa chip, chomwe chimafuna zida zokhala ndi ma conductivity apamwamba komanso matenthedwe abwino. Chojambula chamkuwa chimakwaniritsa zofunikira izi, kuchepetsa bwino ndalama zonyamula ndikuwongolera kutayika kwamafuta ndi magwiridwe antchito amagetsi.
• Njira Zochiritsira Pamwamba: Pogwiritsira ntchito, zojambula zamkuwa nthawi zambiri zimagwiritsidwa ntchito pamwamba monga faifi tambala, malata, kapena plating ya siliva kuti ateteze oxidation ndikuwongolera kusungunuka. Mankhwalawa amapangitsanso kulimba ndi kudalirika kwa zojambulazo zamkuwa muzoyikapo zamtovu.
• Zinthu Zoyendetsa mu Multi-Chip Modules: Ukadaulo wapa-package umaphatikizira tchipisi tambirimbiri ndi zida zopanda pake mu phukusi limodzi kuti mukwaniritse kuphatikiza kwakukulu komanso kachulukidwe kantchito. Chojambula chamkuwa chimagwiritsidwa ntchito kupanga mabwalo olumikizirana mkati ndikukhala ngati njira yoyendetsera pano. Izi zimafuna zojambula zamkuwa kuti zikhale ndi ma conductivity apamwamba komanso mawonekedwe owonda kwambiri kuti akwaniritse magwiridwe antchito apamwamba m'malo ochepa olongedza.
• RF ndi Millimeter-Wave Applications: Zojambulazo za mkuwa zimagwiranso ntchito yofunikira pamayendedwe othamanga kwambiri mu SiP, makamaka pamawayilesi (RF) ndi ma millimeter-wave application. Makhalidwe ake otsika otayika komanso ma conductivity abwino kwambiri amalola kuti achepetse kutsitsa kwazizindikiro bwino ndikuwongolera kufalitsa bwino pamapulogalamu apamwambawa.
• Zogwiritsidwa Ntchito mu Redistribution Layers (RDL): Pakuyika kwa fan-out, zojambula zamkuwa zimagwiritsidwa ntchito popanga gawo logawanso, ukadaulo womwe umagawiranso chip I / O kudera lalikulu. Kuthamanga kwapamwamba komanso kumamatira bwino kwa zojambulazo zamkuwa kumapangitsa kukhala chinthu choyenera kumanga zigawo zogawiranso, kuchulukitsa kachulukidwe ka I/O ndikuthandizira kuphatikiza kwamitundu yambiri.
• Kuchepetsa Kukula ndi Kukhulupirika kwa Signal: Kugwiritsa ntchito zojambulazo zamkuwa m'magawo ogawanso kumathandizira kuchepetsa kukula kwa phukusi ndikuwongolera kukhulupirika ndi liwiro la kutumiza ma siginecha, zomwe ndizofunikira kwambiri pazida zam'manja ndi mapulogalamu apakompyuta ochita bwino kwambiri omwe amafunikira kukula kwapang'onopang'ono komanso magwiridwe antchito apamwamba.
• Kutentha kwa Copper Foil ndi Njira Zotentha: Chifukwa cha matenthedwe ake abwino kwambiri, zojambula zamkuwa zimagwiritsidwa ntchito nthawi zambiri m'makina otentha, mayendedwe otenthetsera, ndi zida zolumikizirana ndi matenthedwe mkati mwa chip ma CD kuti zithandizire kusamutsa kutentha kopangidwa ndi chip kupita kuzinthu zozizirira zakunja. Izi ndizofunikira kwambiri pamatchipisi amphamvu kwambiri komanso mapaketi omwe amafunikira kuwongolera kutentha, monga ma CPU, ma GPU, ndi tchipisi tamagetsi.
• Amagwiritsidwa ntchito ku Through-Silicon Via (TSV) Technology: Mu matekinoloje a 2.5D ndi 3D chip packaging, zojambula zamkuwa zimagwiritsidwa ntchito popanga zinthu zodzaza ndi ma silicon vias, zomwe zimapereka kulumikizana koyima pakati pa tchipisi. Kukhazikika kwapamwamba komanso kusinthika kwa zojambula zamkuwa kumapangitsa kuti ikhale chinthu chokondedwa mumatekinoloje apamwambawa, omwe amathandizira kuphatikiza kachulukidwe kakang'ono komanso njira zazifupi zama siginecha, potero kumathandizira magwiridwe antchito onse.

2. Flip-Chip Packaging

3. Phukusi Lotsogolera Frame

4. System-in-Package (SiP)

5. Fan-Out Packaging

6. Kugwiritsa Ntchito Kutentha kwa Matenthedwe ndi Kuwotcha Kutentha

7. Advanced Packaging Technologies (monga 2.5D ndi 3D Packaging)

Ponseponse, kugwiritsa ntchito zojambulazo za mkuwa pakuyika kwa chip sikumangokhalira kulumikiza kwachikhalidwe komanso kasamalidwe ka kutentha koma kumafikira paukadaulo wonyamula womwe ukubwera monga flip-chip, system-in-package, fan-out package, ndi ma 3D mapaketi. Kapangidwe kazinthu zambiri komanso magwiridwe antchito abwino kwambiri a zojambula zamkuwa zimathandizira kwambiri pakuwongolera kudalirika, magwiridwe antchito, komanso kutsika mtengo kwapackage ya chip.