Kugwiritsa Ntchito Copper Foil mu Ma Chip Packaging

Foyilo yamkuwaikukhala yofunika kwambiri pakuyika ma chip chifukwa cha mphamvu zake zamagetsi, mphamvu zake zoyendetsera kutentha, kuthekera kwake kukonzedwa, komanso kugwiritsa ntchito bwino ndalama. Nayi kusanthula mwatsatanetsatane kwa momwe imagwiritsidwira ntchito poyika ma chip:

1. Kulumikiza Waya Wamkuwa

• Kulowa m'malo mwa Waya wa Golide kapena Aluminiyamu: Mwachikhalidwe, mawaya agolide kapena aluminiyamu akhala akugwiritsidwa ntchito poyika ma chip kuti alumikize magetsi amkati mwa chip ndi ma lead akunja. Komabe, chifukwa cha kupita patsogolo kwa ukadaulo wokonza mkuwa komanso kuganizira za mtengo, foil yamkuwa ndi waya wamkuwa pang'onopang'ono zikukhala zosankha zodziwika bwino. Mphamvu yamagetsi ya Copper ndi pafupifupi 85-95% kuposa ya golide, koma mtengo wake ndi pafupifupi gawo limodzi mwa magawo khumi, zomwe zimapangitsa kuti ikhale chisankho chabwino kwambiri pakugwira ntchito bwino komanso kugwiritsa ntchito bwino ndalama.
• Kugwira Ntchito Kwamagetsi Kowonjezereka: Kulumikiza waya wa mkuwa kumapereka kukana kochepa komanso kuyendetsa bwino kutentha mu ntchito zama frequency ndi ma current amphamvu, zomwe zimachepetsa kutayika kwa mphamvu mu ma chip olumikizirana ndikukweza magwiridwe antchito amagetsi onse. Chifukwa chake, kugwiritsa ntchito zojambulazo zamkuwa ngati chinthu choyendetsera magetsi mu njira zolumikizira kumatha kukulitsa magwiridwe antchito ndi kudalirika kwa ma phukusi popanda kuwonjezera ndalama.
• Amagwiritsidwa ntchito mu ma Electrode ndi ma Micro-Bumps: Mu phukusi la flip-chip, chip imatembenuzidwa kuti ma input/output (I/O) pads pamwamba pake alumikizidwe mwachindunji ku dera lomwe lili pa phukusi. Foil ya mkuwa imagwiritsidwa ntchito popanga ma electrode ndi ma micro-bumps, omwe amagulitsidwa mwachindunji ku substrate. Kukana kutentha kochepa komanso mphamvu zambiri za mkuwa zimathandiza kuti zizindikiro ndi mphamvu zitumizidwe bwino.
• Kudalirika ndi Kusamalira Kutentha: Chifukwa cha kukana kwake bwino ku ma electromigration ndi mphamvu ya makina, mkuwa umapereka kudalirika kwabwino kwa nthawi yayitali pansi pa kusintha kwa kutentha ndi kuchuluka kwa magetsi. Kuphatikiza apo, kutentha kwakukulu kwa mkuwa kumathandiza kutulutsa mwachangu kutentha komwe kumapangidwa panthawi yogwira ntchito ya chip kupita ku substrate kapena heat sink, zomwe zimapangitsa kuti phukusili lizitha kuyang'anira kutentha.
• Zofunika za Chimango cha Lead: Foyilo yamkuwaimagwiritsidwa ntchito kwambiri poika mafelemu a lead, makamaka poika zida zamagetsi. Mafelemu a lead amapereka chithandizo cha kapangidwe kake komanso kulumikizana kwa magetsi kwa chip, zomwe zimafuna zipangizo zomwe zimakhala ndi mphamvu zambiri komanso mphamvu yabwino yopangira kutentha. Foil ya mkuwa imakwaniritsa zofunikira izi, zomwe zimachepetsa ndalama zoyika mafelemu pomwe zimathandizira kutayikira kwa kutentha komanso magwiridwe antchito amagetsi.
• Njira Zochiritsira Pamwamba: Mu ntchito zenizeni, zojambula zamkuwa nthawi zambiri zimachizidwa pamwamba monga nickel, tin, kapena siliva kuti zisawonongeke ndi kusungunuka bwino. Mankhwalawa amawonjezera kulimba ndi kudalirika kwa zojambula zamkuwa mu phukusi la chimango cha lead.
• Zinthu Zoyendetsera Magalimoto mu Ma Module a Multi-Chip: Ukadaulo wa dongosolo mu phukusi umaphatikiza ma chips angapo ndi zinthu zopanda ntchito mu phukusi limodzi kuti akwaniritse kuphatikizana kwakukulu komanso kuchulukana kwa ntchito. Foil yamkuwa imagwiritsidwa ntchito popanga ma circuits olumikizana mkati ndipo amagwira ntchito ngati njira yoyendetsera magetsi. Kugwiritsa ntchito kumeneku kumafuna foil yamkuwa kuti ikhale ndi mphamvu zambiri komanso mawonekedwe owonda kwambiri kuti ikwaniritse magwiridwe antchito apamwamba m'malo ochepa osungiramo zinthu.
• Mapulogalamu a RF ndi Millimeter-Wave: Foil ya mkuwa imagwiranso ntchito yofunika kwambiri pa ma circuits otumizira ma signal a high-frequency mu SiP, makamaka pa ma radio frequency (RF) ndi ma millimeter-wave. Makhalidwe ake otsika otayika komanso kuyendetsa bwino kwambiri kumathandiza kuti ichepetse kuchepa kwa ma signal bwino ndikuwonjezera magwiridwe antchito otumizira ma signal mu ma high-frequency awa.
• Amagwiritsidwa ntchito mu Redistribution Layers (RDL): Mu ma CD otulutsa fan, foil yamkuwa imagwiritsidwa ntchito popanga gawo logawanso, ukadaulo womwe umagawanso chip I/O kudera lalikulu. Kuchuluka kwa mphamvu ya conductivity komanso kumamatira bwino kwa foil yamkuwa kumapangitsa kuti ikhale chinthu chabwino kwambiri chomangira magawo ogawanso, kuwonjezera kuchuluka kwa I/O ndikuthandizira kuphatikiza ma chip ambiri.
• Kuchepetsa Kukula ndi Kukhulupirika kwa Chizindikiro: Kugwiritsa ntchito pepala la mkuwa m'magawo ogawa zinthu kumathandiza kuchepetsa kukula kwa phukusi pamene kuli koyenera kupititsa patsogolo kukhulupirika kwa chizindikiro ndi liwiro lake, zomwe ndizofunikira kwambiri pazida zam'manja ndi mapulogalamu apakompyuta ogwira ntchito kwambiri omwe amafunikira kukula kochepa kwa phukusi komanso magwiridwe antchito apamwamba.
• Ma Sinki Otenthetsera a Copper Foil ndi Mayendedwe a Kutentha: Chifukwa cha kutentha kwake kwabwino kwambiri, zojambulazo zamkuwa nthawi zambiri zimagwiritsidwa ntchito m'malo osungira kutentha, njira zotenthetsera, ndi zinthu zolumikizira kutentha mkati mwa ma chip kuti zithandize kusamutsa kutentha komwe kumapangidwa ndi chip kupita kuzinthu zoziziritsira zakunja. Kugwiritsa ntchito kumeneku ndikofunikira kwambiri m'ma chip amphamvu kwambiri ndi mapaketi omwe amafunikira kuwongolera kutentha molondola, monga ma CPU, ma GPU, ndi ma chip oyang'anira mphamvu.
• Amagwiritsidwa Ntchito mu Ukadaulo wa Through-Silicon Via (TSV): Mu ukadaulo wa 2.5D ndi 3D chip packaging, copper foil imagwiritsidwa ntchito popanga conductive fillers for through-silicon vias, zomwe zimapangitsa kuti pakhale kulumikizana kolunjika pakati pa ma chips. Copper foil imayenda bwino kwambiri komanso kusinthasintha kwake kumapangitsa kuti ikhale chinthu chomwe chimakonda kwambiri muukadaulo wapamwamba uwu wa ma packaging, zomwe zimathandiza kuphatikizana kwamphamvu kwambiri komanso njira zazifupi za chizindikiro, motero zimathandizira magwiridwe antchito onse a dongosolo.

2. Kupaka Ma Flip-Chip

3. Kutsogolera chimango Chopangira

4. Dongosolo Lokhala mu Phukusi (SiP)

5. Kupaka Fan-Out

6. Kusamalira Kutentha ndi Kugwiritsa Ntchito Kutaya Kutentha

7. Ukadaulo Wapamwamba Wopaka Mapaketi (monga 2.5D ndi 3D Packaging)

Ponseponse, kugwiritsa ntchito pepala la mkuwa mu ma chip packaging sikungokhudza kulumikizana kwachikhalidwe komanso kasamalidwe ka kutentha koma kumakhudzanso ukadaulo watsopano wopangira ma packaging monga flip-chip, system-in-package, fan-out packaging, ndi 3D packaging. Makhalidwe ambiri ogwira ntchito komanso magwiridwe antchito abwino a pepala la mkuwa zimathandiza kwambiri pakukweza kudalirika, magwiridwe antchito, komanso kugwiritsa ntchito bwino ndalama zogwirira ma chip packaging.