< img height="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Nkhani - Copper Foil Tin Plating: A Nano-Scale Solution for Soldering and Precision Protection

Copper Foil Tin Plating: A Nano-Scale Solution for Soldering and Precision Protection

Kuyika malata kumapereka "zida zachitsulo zolimba" zazojambula zamkuwa, kuwongolera bwino pakati pa kugulitsa, kukana dzimbiri, komanso kugwiritsa ntchito bwino ndalama. Nkhaniyi ikufotokoza momwe zojambula zamkuwa zokhala ndi malata zakhala zofunikira kwambiri kwa ogula ndi zamagetsi zamagalimoto. Ikuwonetsa njira zazikulu zomangirira ma atomiki, njira zatsopano, ndi kugwiritsa ntchito komaliza, ndikuwunika.CIVEN METALKupita patsogolo kwaukadaulo wa malata plating.

1. Ubwino Utatu Waubwino Wopaka malata
1.1 Kudumpha kwa Quantum mu Kuchita Zogulitsa
Chosanjikiza cha malata (pafupifupi 2.0μm wandiweyani) chimasintha kugulitsa m'njira zingapo:
- Kuwotchera Pang'onopang'ono: malata amasungunuka pa 231.9 ° C, kuchepetsa kutentha kwa mkuwa kuchoka pa 850 ° C kufika pa 250-300 ° C chabe.
- Kunyowetsa Kwabwino: Kuvuta kwa Tin kumatsika kuchokera pa 1.3N/m mpaka 0.5N/m, kuonjezera malo oti solder afalikire ndi 80%.
- Ma IMC Okhathamiritsa (Intermetallic Compounds): Chigawo cha Cu₆Sn₅/Cu₃Sn gradient chimawonjezera mphamvu yakumeta ubweya mpaka 45MPa (kusokera kwa mkuwa wopanda kanthu kumangopeza 28MPa yokha).
1.2 Kulimbana ndi Corrosion: "Dynamic Barrier"
| | Corrosion Scenario | Nthawi Yakulephera Kwa Mkuwa | Tin-Plated Copper Kulephera Nthawi | Chitetezo cha Chitetezo |
| | Industrial Atmosphere | Miyezi 6 (dzimbiri lobiriwira) | Zaka 5 (kuchepa thupi <2%) | 10x pa |
| | Thukuta Corrosion (pH=5) | Maola 72 (kuboola) | Maola 1,500 (palibe kuwonongeka) | 20x |
| | Hydrogen sulfide Corrosion | Maola 48 (akuda) | Maola 800 (palibe kusinthika) | 16x |
1.3 Kuwongolera: Njira ya "Micro-Sacrifice".
- Kulimbana ndi magetsi kumawonjezeka pang'ono, ndi 12% (1.72×10⁻⁸ mpaka 1.93×10⁻⁸ Ω·m).
- Khungu limakhala bwino: Pa 10GHz, kuya kwa khungu kumawonjezeka kuchoka pa 0.66μm kufika pa 0.72μm, zomwe zimapangitsa kuti kuikapo kuwonongeke kukwera kwa 0.02dB/cm.

2. Njira Zovuta: "Kudula vs. Plating"
2.1 Kumanga Kwathunthu (Kudula Usanayambe Kuyika)
- Ubwino: M'mphepete mwake muli yokutidwa kwathunthu, popanda mkuwa wowonekera.
- Zovuta zaukadaulo:
- Mabotolo amayenera kuyendetsedwa pansi pa 5μm (njira zachikhalidwe zimapitilira 15μm).
- Yankho la Plating liyenera kulowa mopitilira 50μm kuti liwonetsetse kufalikira m'mphepete.
2.2 Kuyika Pambuyo Podula (Kuyika Musanadule)
- Mtengo Ubwino: Imawonjezera magwiridwe antchito ndi 30%.
- Nkhani Zovuta:
- Mphepete zamkuwa zowonekera zimayambira 100–200μm.
- Moyo wopopera mchere umachepetsedwa ndi 40% (kuchokera maola 2,000 mpaka maola 1,200).
2.3CIVEN METALNjira ya "Zero-Defect".
Kuphatikiza kudula mwatsatanetsatane laser ndi pulse malata plating:
- Kudula Kulondola: Burrs amasungidwa pansi pa 2μm (Ra = 0.1μm).
- Edge Coverage: Kukhuthala kwa mbali ≥0.3μm.
- Mtengo-Kuchita bwino: Imawononga 18% kutsika kuposa njira zachikhalidwe zonse zokutira.

3. CIVEN METALTin-PlatedChojambula cha Copper: Ukwati wa Sayansi ndi Aesthetics
3.1 Kuwongolera Kolondola kwa Coating Morphology
| | Type | Njira Zoyimira | Zofunika Kwambiri |
| | Bright Tin | Kuchulukana kwapano: 2A/dm², zowonjezera A-2036 | Kuwonetsetsa >85%, Ra=0.05μm |
| | Matte Tin | Kuchulukana kwapano: 0.8A/dm², palibe zowonjezera | Kuwonetsetsa <30%, Ra=0.8μm |
3.2 Ma Metrics Ogwira Ntchito Zapamwamba
| | Metric | Avereji Yamakampani |CIVEN METALTin-Plated Copper | Kusintha |
| | Kupatuka kwa Makulidwe Opaka (%) | ±20 | ±5 | -75% |
| | Mtengo Wopanda Wogulitsa (%) | 8-12 | ≤3 | -67% |
| | Bend Resistance (zozungulira) | 500 (R=1mm) | 1,500 | + 200% |
| | Kukula kwa Tin Whisker (μm/1,000h) | 10-15 | ≤2 | -80% |
3.3 Magawo Ofunikira Ogwiritsa Ntchito
- Mafoni a FPC: Matte malata (manenedwe 0.8μm) amatsimikizira kugulitsa khola kwa 30μm mzere / katayanitsidwe.
- Magalimoto a ECU: Malata owala amatha kupirira kutentha kwa 3,000 (-40 ° C↔ + 125 ° C) popanda kulephera kwa solder.
- Mabokosi a Photovoltaic Junction: Pawiri-mbali malata plating (1.2μm) amakwaniritsa kukhudzana kukana <0.5mΩ, kulimbikitsa dzuwa ndi 0.3%.

4. Tsogolo la Kupaka malata
4.1 Zovala za Nano-Composite
Kupanga zokutira za Sn-Bi-Ag ternary alloy:
- Malo osungunuka otsika kufika 138 ° C (abwino pamagetsi osinthasintha otsika kutentha).
- Imapititsa patsogolo kukana kwa 3x (maola opitilira 10,000 pa 125 ° C).
4.2 Green Tin Plating Revolution
- Mayankho Opanda Cyanide: Amachepetsa COD ya madzi oipa kuchoka pa 5,000mg/L kufika pa 50mg/L.
- Mlingo Wapamwamba Wobwezeretsa Tin: Kupitilira 99.9%, kudula mitengo ndi 25%.
Kuyika kwa malata kumasinthazojambula zamkuwakuchokera pa kondakitala woyambira kupita ku "intelligent interface material."CIVEN METALKuwongolera pamlingo wa atomiki kumakankhira kudalirika komanso kulimba kwa chilengedwe kwa zojambula zamkuwa zokutidwa ndi malata mpaka kutalika kwatsopano. Pamene zamagetsi zamagetsi zimachepa ndipo zamagetsi zamagalimoto zimafuna kudalirika kwambiri,chojambula chamkuwa chopangidwa ndi tiniikukhala mwala wapangodya wa kusintha kwamalumikizidwe.


Nthawi yotumiza: May-14-2025