Passivated Copper Foil: Kupanga Art of "Corrosion Protection Shields" ndi Performance Balance

Passivation ndi njira yofunika kwambiri popanga zopindikazojambula zamkuwa. Imakhala ngati "chishango cha mamolekyulu" pamwamba, kukulitsa kukana kwa dzimbiri ndikuwongolera mosamalitsa momwe zimakhudzira zinthu zofunika kwambiri monga conductivity ndi solderability. Nkhaniyi ikufotokoza za sayansi kumbuyo kwa njira zolimbikitsira, kusinthanitsa magwiridwe antchito, ndi machitidwe aumisiri. KugwiritsaCIVEN METALmwachitsanzo, tiwona phindu lake pakupanga zida zamagetsi zapamwamba kwambiri.

1. Passivation: "Molecular-Level Shield" ya Copper Foil

1.1 Momwe Magawo a Passivation Amapangidwira
Pogwiritsa ntchito mankhwala kapena electrochemical mankhwala, compact oxide wosanjikiza 10-50nm wandiweyani mawonekedwe pamwamba pazojambula zamkuwa. Wopangidwa makamaka ndi Cu₂O, CuO, ndi ma organic complexes, wosanjikiza uyu amapereka:

• Zolepheretsa Pathupi:Kuchuluka kwa mpweya wa okosijeni kumatsika kufika pa 1×10⁻¹⁴cm²/s (kutsika kuchokera pa 5×10⁻⁸ cm²/s kwa mkuwa wopanda kanthu).
• Electrochemical Passivation:Kuchuluka kwa dzimbiri panopa kumatsika kuchoka pa 10μA/cm² kufika pa 0.1μA/cm².
• Chemical Inertness:Mphamvu zaulere zapamtunda zimachepetsedwa kuchoka pa 72mJ/m² kufika pa 35mJ/m², zomwe zimapondereza kuchitapo kanthu.

1.2 Ubwino Wachikulu Asanu wa Kuchita Zochita

2. “Lupanga lakuthwa konsekonse” la zigawo za Passivation—ndi Momwe Mungaligwiritsire Ntchito

2.1 Kuwunika Zowopsa

• Kuchepetsa Pang'ono mu Conductivity:The passivation wosanjikiza kumawonjezera kuya kwa khungu (pa 10GHz) kuchokera 0.66μm kuti 0.72μm, koma kusunga makulidwe pansi 30nm, resistivity kuwonjezeka akhoza okha pansi 5%.
• Mavuto a Soldering:Mphamvu yapansi panthaka imawonjezera milingo ya solder yonyowa kuchokera pa 15 ° mpaka 25 °. Kugwiritsa ntchito solder pastes (mtundu wa RA) kumatha kuthana ndi izi.
• Mavuto a Adhesion:Mphamvu zomangira utomoni zitha kutsika 10-15%, zomwe zitha kuchepetsedwa pophatikiza njira zowongola komanso zosokoneza.

2.2CIVEN METAL's Balance Approach

Gradient Passivation Technology:

• Base Layer:Kukula kwa Electrochemical kwa 5nm Cu₂O yokhala ndi (111) yokonda kwambiri.
• Gulu Lapakatikati:Filimu yodziphatikiza yokha ya 2-3nm benzotriazole (BTA).
• Gulu Lakunja:Silane coupling agent (APTES) kuti apititse patsogolo kumamatira kwa utomoni.

Zotsatira Zokhathamiritsa:

3. CIVEN METAL's Passivation Technology: Kufotokozeranso Miyezo Yachitetezo

3.1 Dongosolo la Chitetezo cha magawo anayi

1. Ultra-Thin oxide Control:Kugunda kwa anodization kumakwaniritsa makulidwe osiyanasiyana mkati mwa ± 2nm.
2. Zigawo za Organic-Inorganic Hybrid:BTA ndi silane amagwira ntchito limodzi kuti achepetse dzimbiri mpaka 0.003mm/chaka.
3. Chithandizo cha Surface Activation:Kuyeretsa kwa plasma (kusakaniza kwa gasi wa Ar/O₂) kumabweza ngodya zonyowa za solder ku 18 °.
4. Kuwunika Nthawi Yeniyeni:Ellipsometry imatsimikizira makulidwe a passivation mkati mwa ± 0.5nm.

3.2 Kutsimikizika Kwachilengedwe Kwambiri

• Kutentha Kwambiri ndi Kutentha:Pambuyo pa maola 1,000 pa 85 ° C / 85% RH, kukana kwapamwamba kumasintha ndi zosakwana 3%.
• Thermal Shock:Pambuyo pa 200 kuzungulira -55 ° C mpaka + 125 ° C, palibe ming'alu yomwe imawonekera pagawo la passivation (kutsimikiziridwa ndi SEM).
• Kukaniza Chemical:Kukana kwa 10% HCl nthunzi kumawonjezeka kuchoka pa mphindi zisanu kufika pa mphindi 30.

3.3 Kugwirizana Pamapulogalamu Onse

• 5G Milimeter-Wave Antennas:Kutayika kwa 28GHz kutsika mpaka 0.17dB/cm (poyerekeza ndi opikisana nawo '0.21dB/cm).
• Zamagetsi Zagalimoto:Imadutsa mayeso opopera mchere a ISO 16750-4, ndikuzungulira mpaka 100.
• IC Substrates:Mphamvu yomatira yokhala ndi utomoni wa ABF imafika 1.8N/cm (avereji yamakampani: 1.2N/cm).

4. Tsogolo la Passivation Technology

4.1 Atomic Layer Deposition (ALD) Technology
Kupanga makanema a nanolaminate passivation kutengera Al₂O₃/TiO₂:

• Makulidwe:<5nm, ndi resistivity kuwonjezeka ≤1%.
• Kukaniza kwa CAF (Conductive Anodic Filament):5x kusintha.

4.2 Magawo Odzichiritsa Odzichiritsa
Kuphatikiza microcapsule corrosion inhibitors (benzimidazole zotumphukira):

• Kudzichiritsa Mwachangu:Kupitilira 90% mkati mwa maola 24 mutatha kukanda.
• Moyo Wautumiki:Kufikira zaka 20 (poyerekeza ndi zaka 10-15).

Pomaliza:
Chithandizo cha Passivation chimakwaniritsa bwino pakati pa chitetezo ndi magwiridwe antchito ogubuduzazojambula zamkuwa. Kudzera mu nzeru zatsopano,CIVEN METALamachepetsa passivation's downsides, kusandulika kukhala "zosaoneka zida zankhondo" kuti boosts mankhwala kudalirika. Pamene makampani opanga zamagetsi akupita kukachulukirachulukira komanso kudalirika, kuwongolera kolondola komanso koyendetsedwa bwino kwakhala mwala wapangodya wopanga zojambula zamkuwa.