Roughening Pambuyo Kuchiza kwa Copper Foil: "Anchor Lock" Interface Technology ndi Comprehensive Application Analysis

M'munda wazojambula zamkuwakupanga, roughening pambuyo mankhwala ndi ndondomeko kiyi potsekula zakuthupi mawonekedwe kugwirizana mphamvu. Nkhaniyi ikuwunika kufunikira kwa chithandizo chamankhwala movutikira m'njira zitatu: mechanical anchoring effect, njira zoyendetsera ntchito, komanso kusinthika kwakugwiritsa ntchito komaliza. Imayang'ananso kufunika kwa ukadaulo uwu m'magawo ngati kulumikizana kwa 5G ndi mabatire atsopano amphamvu, kutengeraCIVEN METAL's zopambana luso.

1. Chithandizo Chachipongwe: Kuchokera ku "Smooth Trap" kupita ku "Anchored Interface"

1.1 Zoyipa Zowopsa za Malo Osalala

Kukakala koyambirira (Ra) kwazojambula zamkuwaMawonekedwe ake amakhala osakwana 0.3μm, zomwe zimatsogolera kuzinthu zotsatirazi chifukwa cha mawonekedwe ake ngati galasi:

• Kumangirirana Kwathupi Kokwanira: Malo okhudzana ndi utomoni ndi 60-70% yokha yamtengo wapatali.
• Zolepheretsa Chemical Bonding: Dense oxide wosanjikiza (Cu₂O makulidwe pafupifupi 3-5nm) amalepheretsa kuwonekera kwa magulu omwe akugwira ntchito.
• Thermal Stress Sensitivity: Kusiyana kwa CTE (Coefficient of Thermal Expansion) kungayambitse mawonekedwe a delamination (ΔCTE = 12ppm/°C).

1.2 Zotsogola Zitatu Zaumisiri mu Njira Zowononga

Pakupanga mawonekedwe a micron-level atatu-dimensional (onani Chithunzi 1), wosanjikizawo amakwaniritsa:

• Mechanical Interlocking: Mitundu yolowera utomoni "barbed" nangula (kuya> 5μm).
• Chemical Activation: Kuwonetsa (111) ndege zamakristalo zomwe zimagwira ntchito kwambiri kumawonjezera kachulukidwe wa malo ku 10⁵ masamba/μm².
• Kutenthetsa Kupsinjika kwa Matenthedwe: Mapangidwe a porous amatenga 60% ya kupsinjika kwamafuta.
• Njira Yopangira: Acidic copper plating solution (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (duty cycle 30%, frequency 100Hz)
• Zomangamanga:
  • Copper dendrite kutalika 1.2-1.8μm, awiri 0.5-1.2μm.
  • Oxygen yapamtunda ≤200ppm (kusanthula kwa XPS).
  • Kukana kukhudzana <0.8mΩ·cm².
• Njira Yopangira: Cobalt-nickel alloy plating solution (Co²+ 15g/L, Ni²+ 10g/L) + Chemical Displacement Reaction (pH 2.5-3.0)
• Zomangamanga:
  • CoNi alloy tinthu kukula 0.3-0.8μm, stacking kachulukidwe> 8×10⁴ particles/mm².
  • Mpweya wa okosijeni pamwamba ≤150ppm.
  • Kukana kukhudzana <0.5mΩ·cm².

2. Red Oxidation vs. Black Oxidation: The Process Secrets Kumbuyo kwa Mitundu

2.1 Red Oxidation: "Zida" za Copper

2.2 Black Oxidation: Zida za Aloyi

2.3 Zolinga Zamalonda Kumbuyo Kwa Kusankha Kwamitundu

Ngakhale zizindikiro zazikulu zogwirira ntchito (zomatira ndi ma conductivity) zofiira ndi zakuda oxidation zimasiyana ndi zosakwana 10%, msika umasonyeza kusiyana koonekeratu:

• Zojambula Zamkuwa Zofiira Oxidized: Amawerengera 60% ya gawo la msika chifukwa cha mtengo wake wopindulitsa (12 CNY / m² vs. black 18 CNY/m²).
• Black Oxidized Copper Foil: Imalamulira msika wokwera kwambiri (ma FPC okwera pamagalimoto, ma millimeter-wave PCB) omwe ali ndi gawo la 75% chifukwa cha:
  • 15% kuchepetsa kutayika kwafupipafupi (Df = 0.008 vs. red oxidation 0.0095 pa 10GHz).
  • 30% yasintha kukana kwa CAF (Conductive Anodic Filament).

3. CIVEN METAL: "Nano-Level Masters" a Roughening Technology

3.1 Ukadaulo Watsopano wa "Gradient Roughening".

Kudzera mu magawo atatu owongolera,CIVEN METALimakulitsa mawonekedwe a pamwamba (onani Chithunzi 2):

1. Nano-Crystalline Seed Layer: Electro-deposition of cores cores 5-10nm mu kukula, kachulukidwe> 1 × 10¹¹ particles/cm².
2. Kukula kwa Micron Dendrite: Kugunda kwapano kumawongolera dendrite orientation (kuyika patsogolo (110) mayendedwe).
3. Surface Passivation: Kupaka kwa Organic silane coupling agent (APTES) kumathandizira kukana kwa okosijeni.

3.2 Kuchita Kuposa Miyezo Yamakampani

3.3 End-Use Applications Matrix

• 5G Base Station PCB: Amagwiritsa ntchito zojambulazo zakuda zamkuwa (Ra = 1.5μm) kuti akwaniritse <0.15dB/cm kutayika kwa kuyika pa 28GHz.
• Zosonkhanitsa Battery za Mphamvu: Red okosijenizojambula zamkuwa(tensile mphamvu 380MPa) imapereka moyo wozungulira> 2000 cycles (mtundu wa 1500 cycles).
• Ma FPC amlengalenga: Wosanjikiza wosanjikiza umalimbana ndi kutenthedwa kwa kutentha kuchokera -196 ° C mpaka +200 ° C kwa mizungu 100 popanda delamination.

4. Nkhondo Yamtsogolo Yazojambula Zamkuwa

4.1 Ultra-Roughening Technology

Pazofuna zoyankhulirana za 6G terahertz, mawonekedwe a serrated okhala ndi Ra = 3-5μm akupangidwa:

• Dielectric Constant Stability: Kupititsa patsogolo ku ΔDk <0.01 (1-100GHz).
• Thermal Resistance: Kuchepetsedwa ndi 40% (kukwaniritsa 15W/m·K).

4.2 Smart Roughening Systems

Kuzindikira masomphenya a AI + ophatikizika + kusintha kwakusintha kwamayendedwe:

• Real-Time Surface Monitoring: Zitsanzo pafupipafupi mafelemu 100 pamphindikati.
• Kusintha kwa Kachulukidwe KakalipanoKulondola: ± 0.5A/dm².

Kuchiza kwa mkuwa pambuyo pa chithandizo kwasintha kuchokera ku "njira yosankha" kupita "kuchulutsa magwiridwe antchito." Kupyolera muzochita zatsopano komanso kuwongolera khalidwe labwino kwambiri,CIVEN METALyakankhira ukadaulo wovuta kuti ukhale wolondola pamlingo wa atomiki, ndikupereka chithandizo choyambira pakukweza makampani amagetsi. M'tsogolomu, pa mpikisano wopeza matekinoloje anzeru, okwera pafupipafupi, komanso odalirika, aliyense amene akudziwa bwino "micro-level code" yaukadaulo waukadaulo adzalamulira malo apamwamba kwambiri.zojambula zamkuwamakampani.

(Magwero a Zambiri:CIVEN METALLipoti laukadaulo la 2023, IPC-4562A-2020, IEC 61249-2-21)