Khodi Yopangira Zinthu Mwanzeru ya Foil Yosungidwa ndi Ma Electrodeposited Copper: Kuchokera ku Atomic-Level Deposition mpaka Kusintha kwa Kusintha kwa Mafakitale

Yoyikidwa mu Electrode (ED)pepala la mkuwaNdi msana wosaoneka wa zamagetsi amakono. Mbiri yake yopyapyala kwambiri, kusinthasintha kwakukulu, komanso kuyendetsa bwino kwambiri kumapangitsa kuti ikhale yofunika kwambiri m'mabatire a lithiamu, ma PCB, ndi zamagetsi osinthasintha.zojambulazo zamkuwa zokulungidwa, zomwe zimadalira kusintha kwa makina,ED foil yamkuwaimapangidwa pogwiritsa ntchito electrochemical deposition, zomwe zimapangitsa kuti atomiki ilamulire komanso isinthe momwe imagwirira ntchito. Nkhaniyi ikuwulula kulondola kwa kapangidwe kake komanso momwe zatsopano zikusinthira mafakitale.

I. Kupanga Kokhazikika: Kulondola mu Uinjiniya Wamagetsi

1. Kukonzekera kwa Electrolyte: Fomula Yokonzedwa Bwino Kwambiri
Electrolyte yoyambira imakhala ndi sulfate yamkuwa yoyera kwambiri (80–120g/L Cu²⁺) ndi sulfuric acid (80–150g/L H₂SO₄), ndipo gelatin ndi thiourea zimawonjezeredwa pamlingo wa ppm. Makina apamwamba a DCS amawongolera kutentha (45–55°C), kuthamanga kwa madzi (10–15 m³/h), ndi pH (0.8–1.5) molondola. Zowonjezera zimalowa mu cathode kuti zitsogolere kupangika kwa nano-level ndikuletsa zolakwika.

2. Kuyika kwa Foil: Kugwira Ntchito Mwanzeru kwa Atomiki
Mu ma cell a electrolytic okhala ndi ma titanium cathode rolls (Ra ≤ 0.1μm) ndi ma lead alloy anode, 3000–5000 A/m² DC current imayendetsa copper ion deposition pamwamba pa cathode mu (220) orientation. Kukhuthala kwa foil (6–70μm) kumakonzedwa bwino kudzera mu liwiro la roll (5–20 m/min) ndi kusintha kwa current, zomwe zimapangitsa kuti makulidwe a ±3% ayende bwino. Foil yopyapyala kwambiri imatha kufika 4μm—1/20th makulidwe a tsitsi la munthu.

3. Kutsuka: Malo Oyera Kwambiri ndi Madzi Oyera
Njira yotsukira yosinthira ya magawo atatu imachotsa zotsalira zonse: Gawo 1 limagwiritsa ntchito madzi oyera (≤5μS/cm), Gawo 2 limagwiritsa ntchito mafunde a ultrasonic (40kHz) kuti lichotse zotsalira za organic, ndipo Gawo 3 limagwiritsa ntchito mpweya wotentha (80–100°C) kuti uume popanda mawanga. Izi zimapangitsa kutipepala la mkuwayokhala ndi mpweya wochepa <100ppm ndi zotsalira za sulfure <0.5μg/cm².

4. Kudula ndi Kuyika Mapaketi: Kulondola Kwambiri mpaka Micron Yomaliza
Makina odulira othamanga kwambiri okhala ndi laser edge control amaonetsetsa kuti m'lifupi mwake muli mkati mwa ±0.05mm. Ma vacuum anti-oxidation packaging okhala ndi zizindikiro za chinyezi amasunga mawonekedwe a pamwamba panthawi yonyamula ndi kusungira.

II. Kusintha kwa Chithandizo cha Pamwamba: Kutsegula Magwiridwe Abwino a Makampani

1. Mankhwala Ochepetsa Kutupa: Kumangirira Kakang'ono Kuti Kukhale Kogwirizana Kwambiri

Chithandizo cha Nodule:Kupaka kwa pulse mu yankho la CuSO₄-H₂SO₄-As₂O₃ kumapanga timibulu ta 2–5μm pamwamba pa foil, zomwe zimapangitsa kuti mphamvu yomatirira ikhale 1.8–2.5N/mm—yabwino kwambiri pa ma circuit board a 5G.

Kukankhira kwa Mipata Yawiri:Tinthu ta mkuwa tating'onoting'ono ndi tating'onoting'ono timawonjezera malo pamwamba ndi 300%, zomwe zimapangitsa kuti slurry imamatire bwino mu lithiamu battery anodes ndi 40%.

2. Kuphimba Ntchito: Zida Zazikulu Zolimbitsa Thupi Kuti Zikhale Zolimba

Kuyika Zinki/Tin:Chitsulo cha 0.1–0.3μm chimawonjezera mphamvu yolimbana ndi kupopera mchere kuyambira maola 4 mpaka 240, zomwe zimapangitsa kuti chikhale chogwiritsidwa ntchito kwambiri pa mabatire a EV.

Chophimba cha aloyi cha nickel-cobalt:Magawo a nano-grain opangidwa ndi pulse-plated (≤50nm) amakwaniritsa kulimba kwa HV350, kuthandizira ma substrates opindika a mafoni a m'manja opindika.

3. Kukana Kutentha Kwambiri: Kupulumuka Nthawi Yoopsa
Zophimba za Sol-gel SiO₂-Al₂O₃ (100–200nm) zimathandiza kuti foil isatenthe kutentha kwa 400°C (oxidation <1mg/cm²), zomwe zimapangitsa kuti ikhale yoyenera kwambiri pamakina olumikizirana ndi ndege.

III. Kupatsa Mphamvu Malire Atatu Aakulu a Mafakitale

1. Mabatire Atsopano Amagetsi
Foyilo ya CIVEN METAL ya 3.5μm (yokhala ndi mphamvu ya ≥200MPa, ≥3% kutalika) imawonjezera mphamvu ya batri ya 18650 ndi 15%. Foyilo yokhala ndi mabowo apadera (30–50% porosity) imathandiza kupewa kupangika kwa lithiamu dendrite m'mabatire olimba.

2. Ma PCB Otsogola
Foyilo ya low-profile (LP) yokhala ndi Rz ≤1.5μm imachepetsa kutayika kwa chizindikiro m'mabodi a 5G millimeter-wave ndi 20%. Foyilo ya Ultra-low profile (VLP) yokhala ndi reverse-treated finish (RTF) imathandizira kuchuluka kwa deta ya 100Gb/s.

3. Zipangizo Zamagetsi Zosinthasintha
AnnealedED foil yamkuwa(≥20% kutalika) kokhala ndi mafilimu a PI kumatha kupindika kopitilira 200,000 (1mm radius), komwe kumagwira ntchito ngati "chigoba chosinthika" cha zovala zovalidwa.

IV. CIVEN CHITSULO: Mtsogoleri Wosintha Zinthu mu ED Copper Foil

Monga nyumba yamphamvu chete mu ED mkuwa foil,CHITSULO CHA CIVENyapanga njira yopangira zinthu yofulumira komanso yokhazikika:

Laibulale Yowonjezera ya Nano:Zosakaniza zoposa 200 zowonjezera zomwe zimapangidwa kuti zikhale zolimba kwambiri, zotalikirana, komanso zokhazikika pa kutentha.

Kupanga Zojambula Zotsogozedwa ndi AI:Ma parameter okonzedwa bwino a AI amatsimikizira kulondola kwa makulidwe a ±1.5% komanso kusalala kwa ≤2I.

Malo Othandizira Pamwamba:Mizere 12 yodzipereka yomwe imapereka zosankha 20+ zomwe zingasinthidwe (kukonza, kuphimba, ndi zokutira).

Kupanga Zinthu Mwatsopano:Kubwezeretsa zinyalala pa intaneti kumawonjezera kugwiritsa ntchito mkuwa wosaphika kufika pa 99.8%, kuchepetsa mtengo wa zojambulazo ndi 10–15% pansi pa avareji yamsika.

Kuchokera ku kuwongolera kwa atomiki mpaka kukonza magwiridwe antchito a macro-scale,ED foil yamkuwaikuyimira nthawi yatsopano ya uinjiniya wazinthu. Pamene kusintha kwapadziko lonse lapansi pakukhazikitsa magetsi ndi zida zanzeru kukuchulukirachulukira,CHITSULO CHA CIVENimatsogolera gululi ndi chitsanzo chake cha "atomic precision + application innovation"—kupititsa patsogolo kupanga kwa China kupita pamwamba pa unyolo wamtengo wapatali padziko lonse lapansi.