Electrodeposited (ED)zojambula zamkuwandi msana wosaoneka wa zamagetsi zamakono. Mbiri yake yowonda kwambiri, ductility yayikulu, komanso kuwongolera bwino kumapangitsa kuti ikhale yofunikira mu mabatire a lithiamu, ma PCB, ndi zamagetsi zosinthika. Mosiyanaadagulung'undisa mkuwa zojambulazo, yomwe imadalira makina osinthika,ED copper zojambulazoamapangidwa ndi electrochemical deposition, kukwaniritsa kulamulira mulingo wa atomiki ndi makonda ntchito. Nkhaniyi ikuwulula mwatsatanetsatane momwe amapangira komanso momwe njira zatsopano zisinthira mafakitale.
I. Kupanga Mokhazikika: Kulondola mu Electrochemical Engineering
1. Kukonzekera kwa Electrolyte: Nano-Optimized Formula
Electrolyte yoyambira imakhala ndi sulfate yamkuwa yoyera kwambiri (80-120g/L Cu²⁺) ndi sulfuric acid (80-150g/L H₂SO₄), yokhala ndi gelatin ndi thiourea yowonjezeredwa pamlingo wa ppm. Makina apamwamba a DCS amawongolera kutentha (45–55°C), kuthamanga (10–15 m³/h), ndi pH (0.8–1.5) molondola. Zowonjezera zimawonjezera ku cathode kuti ziwongolere kapangidwe ka tirigu wa nano-level ndikuletsa zolakwika.
2. Kuyika kwa Foil: Atomic Precision in Action
M'maselo a electrolytic okhala ndi titaniyamu cathode rolls (Ra ≤ 0.1μm) ndi anode aloyi yotsogolera, 3000-5000 A/m² DC panopa imayendetsa kuyika kwa ayoni yamkuwa pamtunda wa cathode mu (220) malo. Makulidwe a zojambulazo (6-70μm) amawunikidwa ndendende kudzera pa liwiro la mpukutu (5-20 m/min) ndi zosintha zamakono, kukwaniritsa ± 3% kuwongolera makulidwe. Chojambula chopyapyala kwambiri chimatha kufika 4μm—1/20th makulidwe a tsitsi la munthu.
3. Kusamba: Malo Oyera Kwambiri Ndi Madzi Oyera
Njira yotsuka yamagulu atatu imachotsa zotsalira zonse: Gawo 1 limagwiritsa ntchito madzi oyera (≤5μS/cm), Gawo 2 limagwiritsa ntchito mafunde a ultrasonic (40kHz) kuti lichotse zotsalira za organic, ndipo Gawo 3 limagwiritsa ntchito mpweya wotentha (80-100 ° C) poyanika popanda malo. Izi zimabweretsazojambula zamkuwaokhala ndi mpweya wokwanira <100ppm ndi zotsalira za sulfure <0.5μg/cm².
4. Kudula ndi Kuyika: Kulondola mpaka Final Micron
Makina othamangitsa othamanga kwambiri okhala ndi kuwongolera m'mphepete mwa laser amatsimikizira kulolerana m'lifupi mkati mwa ± 0.05mm. Kuyika kwa vacuum anti-oxidation yokhala ndi zizindikiritso za chinyezi kumateteza mawonekedwe apamwamba panthawi yoyendetsa ndi kusunga.
II. Kusintha Kwamankhwala Pamwamba: Kutsegula Magwiridwe Okhazikika Pamakampani
1. Mankhwala Osokoneza: Micro-Anchoring for Enhanced Bonding
Chithandizo cha Nodule:Pulse plating mu CuSO₄-H₂SO₄-As₂O₃ yankho limapanga 2-5μm nodule pamwamba pa zojambulazo, kupititsa patsogolo mphamvu zomatira ku 1.8-2.5N/mm-zabwino kwa matabwa ozungulira a 5G.
Dual-Peak Roughening:Tinthu tating'ono tating'ono tating'ono tating'ono tating'ono tating'ono tating'ono tating'onoting'ono timawonjezera malo ndi 300%, ndikuwongolera kumamatira kwa batri la lithiamu ndi 40%.
2. Kupaka Pantchito: Zida za Molecular-Scale for Durability
Kupaka Zinc/Tin Plating:Kusanjikiza kwachitsulo kwa 0.1-0.3μm kumakulitsa kukana kutsitsi kwa mchere kuchokera ku 4 mpaka maola 240, ndikupangitsa kuti ikhale yopita kwa ma batire a EV.
Zovala za Nickel-Cobalt Alloy:Zigawo za nano-grain (≤50nm) zimakwaniritsa kuuma kwa HV350, kuthandizira magawo opindika amafoni opindika.
3. Kukana Kutentha Kwambiri: Kupulumuka Kwambiri
Zopaka za Sol-gel SiO₂-Al₂O₃ (100-200nm) zimathandizira zojambulazo kukana makutidwe ndi okosijeni pa 400 ° C (oxidation <1mg/cm²), kupangitsa kuti ikhale yogwirizana bwino ndi makina opangira mawaya apamlengalenga.
III. Kupatsa Mphamvu Zazigawo Zitatu Zazikulu Zamakampani
1. Mabatire Amphamvu Atsopano
CIVEN METAL's 3.5μm zojambulazo (≥200MPa tensile, ≥3% elongation) imawonjezera 18650 mphamvu ya batire ndi 15%. Zojambula zokhala ndi perforated (30-50% porosity) zimathandiza kupewa mapangidwe a lithiamu dendrite m'mabatire olimba.
2. Ma PCB apamwamba
Zojambula zotsika (LP) zokhala ndi Rz ≤1.5μm zimachepetsa kutayika kwa ma siginecha mu 5G mamilimita-wave board ndi 20%. Zojambula za Ultra-low profile (VLP) zokhala ndi reverse-treated finish (RTF) zimathandizira mitengo ya data ya 100Gb/s.
3. Flexible Electronics
AnnealedED copper zojambulazo(≥20% elongation) yopangidwa ndi mafilimu a PI imapirira kupindika kopitilira 200,000 (1mm radius), kumachita ngati "mafupa osinthika" a zovala.
IV. CIVEN METAL: Mtsogoleri Wosintha Mwamakonda mu ED Copper Foil
Monga nyumba yopangira mphamvu muzojambula zamkuwa za ED,CIVEN METALwapanga njira yokhazikika, yopangira modular:
Nano-Additive Library:Zophatikizira zopitilira 200 zopangidwira kulimba kwamphamvu, kutalika, komanso kukhazikika kwamafuta.
AI-Guided Foil Production:Magawo okhathamiritsa a AI amatsimikizira kulondola kwa ± 1.5% komanso kusalala kwa ≤2I.
Malo Ochizira Pamwamba:Mizere 12 yodzipatulira yomwe imapereka zosankha 20+ zomwe mungasinthire makonda (zowuma, zokutira, zokutira).
Mtengo Watsopano:Kubwezeretsa zinyalala zam'mizere kumakulitsa kugwiritsa ntchito mkuwa wosaphika mpaka 99.8%, ndikuchepetsa mtengo wa zojambulazo ndi 10-15% pansi pa msika.
Kuchokera pakuwongolera ma latisi a atomiki kupita ku kukonza magwiridwe antchito a macro-scale,ED copper zojambulazoikuyimira nyengo yatsopano ya uinjiniya wa zinthu. Pamene kusintha kwapadziko lonse kuzinthu zamagetsi ndi zipangizo zamakono zikufulumizitsa,CIVEN METALamatsogola ndi chitsanzo chake cha “atomic precision + application innovation”—kukankhira zopanga zapamwamba zaku China kupita pamwamba pa tcheni chamtengo wapatali padziko lonse lapansi.
Nthawi yotumiza: Jun-03-2025