Kupanga Molondola ndi Kugwiritsa Ntchito Zopangidwa Mwamakonda kwa Cholembera Chokulungidwa cha Mkuwa — Kuchokera pa Kusanthula Njira mpaka Kupatsa Mphamvu Makampani

Chojambula cha mkuwa chopindidwaimagwira ntchito yofunika kwambiri m'mafakitale apamwamba monga ma circuits amagetsi, mabatire atsopano amagetsi, ndi chitetezo chamagetsi. Kugwira ntchito kwake ndi kudalirika kwake kumatsimikiziridwa ndi kulondola kwa njira yake yopangira komanso kusinthasintha kwa kusintha kwake. Nkhaniyi ikufotokoza za ulendo wonse wopanga wa rolledpepala la mkuwakuchokera pamalingaliro aukadaulo ndipo imafotokoza momwe imalimbikitsira mafakitale amakono kudzera mu mayankho okonzedwa bwino.

I. Njira Yopangira Yokhazikika: Kulinganiza Kulondola ndi Kuchita Bwino

1. Kuponya Mkuwa wa Ingot: Poyambira pa Kuyera ndi Kapangidwe kake
Pogwiritsa ntchito mkuwa wa electrolytic woyeretsedwa kwambiri (≥99.99%), zinthuzo zimasungunuka ndi vacuum ndikuponyedwa mosalekeza mu ma ingot a makulidwe a 100–200mm. Kuzizira kumayendetsedwa mosamala kuti zitsimikizire kuti tinthu tating'onoting'ono, tofanana komanso kupewa ming'alu ikagubuduzika pambuyo pake.

2. Kuzungulira Kotentha: Gawo Loyamba la Kuchepetsa Kukhuthala
Ma ingot a mkuwa amatenthedwa kufika pa 5–10mm pa kutentha kwa 700–900°C pogwiritsa ntchito mphero yosinthika. Mafuta odzola amachepetsa kuwonongeka kwa ma roller ndipo amachepetsa kupsinjika kwamkati chifukwa cha kuponyedwa, ndikuyika maziko ozungulira bwino.

3. Kusonkhanitsa: Kuyeretsa ndi Kuyambitsa Pamwamba
Kusakaniza kwa nitric-sulfuric acid (10–15% concentration) kumagwiritsidwa ntchito kuchotsa okosijeni. Chithandizo cha electro-polishing chimachepetsa kuuma kwa pamwamba (Ra) kufika pansi pa 0.2μm, zomwe zimapangitsa kuti zotsatira zabwino kwambiri zipitirire.

4. Kuzungulira Molondola: Kukwaniritsa Kulondola kwa Micron-Level
Ma pass angapo ozizira ozungulira amachepetsa mkuwa kufika pa 0.1–0.2mm. Ndi ma mphero olimba kwambiri komanso ma gauge a laser thickness (±2μm accuracy), kusiyana kwa makulidwe kumasungidwa mkati mwa 1%. Mphamvu yozungulira ndi kupsinjika zimayendetsedwa mosamala kuti ming'alu ya m'mphepete isagwe.

5. Kuzungulira kwa Foil: Kupanga Malo Oonda Kwambiri
Makina apamwamba opangira zojambulazo amagwiritsa ntchito njira yosinthira mipata yaying'ono komanso mafuta opaka kuti afike pa makulidwe a 9–90μm. Kumaliza kwa pamwamba kumaposa ISO 1302 grade 12, koyenera kugwiritsidwa ntchito pakhungu la 5G lomwe limagwira ntchito pafupipafupi.

6. Kuchotsa mafuta: Gawo Lomaliza la Ukhondo wa Pamwamba
Kuyeretsa kwa ultrasound pamodzi ndi alkaline degreasing (pH 11–13) kumachotsa mafuta otsala ozungulira. Zotsalira za kaboni zimayendetsedwa pansi pa 5mg/m², zomwe zimapangitsa kuti pakhale maziko oyera ochizira pamwamba.

7. Kudula ndi Kupaka: Kulondola kwa Mafakitale ndi Ubwino Wokongola
Masamba okhala ndi diamondi amafika polekerera m'lifupi mwake ±0.1mm. Zinthuzo zimapakidwa mu vacuum mu filimu yotsutsana ndi okosijeni ndipo zimasungidwa m'malo olamulidwa ndi nyengo (25±2°C, ≤70% RH) kuti zitsimikizire kuti kutumiza kuli kokhazikika.

II. Kukonza Koyenera: Kupititsa patsogolo Kugwira Ntchito Kwa Makampani Omwe Amagwira Ntchito

1. Kukongoletsa: Kusintha Katundu wa Makina

Mtima Wofewa (O):Kumangiriridwa pa 400–600°C pansi pa mlengalenga wa H₂/N₂ kwa maola 2–4. Mphamvu ya ma tensile imatsika kufika pa 200–250MPa ndipo kutalika kumakwera kufika pa 25–40%, komwe ndi koyenera kwambiri popindika ndi flex circuit dynamic.

Mtima Wolimba (H):Imasunga mphamvu yolimba ngati ntchito (400–500MPa), kuonetsetsa kuti magawo a IC ali olimba.

2. Mankhwala Okhudza Malo Ozungulira: Kukweza Magwiridwe Antchito

Kukanikiza:Kudula kwa mankhwala kumapanga timibulu ta 1–2μm, zomwe zimapangitsa kuti utomoni ukhale wolimba kwambiri pa 1.5N/mm kapena kuposerapo—kuthetsa mavuto a delamination m'mabodi a 5G.

Kuyika kwa nikeli/Tin:Zophimba za 0.1–0.3μm zimapereka kukana dzimbiri kwa 10×, zoyenera ma tabu a batri a EV.

Chophimba Chotentha Kwambiri:Zn nano-coating imasunga kukhazikika kwa zojambulazo pa 300°C, zomwe zimathandiza kuti mawaya a ndege azigwiritsidwa ntchito.

III. Kupatsa Mphamvu Makampani Ofunika Kwambiri Kudzera mu Njira Zatsopano

Zamagetsi:Foyilo ya 9μm yolumikizidwa ndi roughening imalola kuti mzere wa bolodi la HDI ukhale wochepera 12μm, zomwe zimapangitsa kuti foni yam'manja ikhale yocheperako.

Mabatire a EV:Chophimba chofewa chokhala ndi kutalika kwa ≥20% chimapirira makutu opitilira 3000, zomwe zimawonjezera kudalirika kwa paketi ya batri.

Kuteteza kwa EMI:Chojambula chopangidwa ndi nikeli chimateteza 120dB pa 10GHz, chomwe ndi choyenera kwambiri pa zomangamanga za malo osungira deta.

IV. CIVEN CHITSULO: Kukhazikitsa Muyezo mu Mayankho Opangidwa ndi Copper Foil

Monga mtsogoleri muzojambulazo zamkuwa zokulungidwakupanga,CHITSULO CHA CIVENyapanga njira yosinthira yopangira yomwe imaphatikiza njira zokhazikika ndi zosintha za modular:

Ma workshop oyeretsa kwambiri komanso kuwongolera kwa MES kumathandizira makulidwe ndi kusalala kwa ±2μm ≤1I.

Zitsulo zotenthetsera zomwe zingakonzedwe zimatha kugwira ntchito mpaka maoda 20 apadera nthawi imodzi.

"Laibulale yokonzera pamwamba" ya mwiniwake ili ndi mitundu 12 yokanda ndi njira 8 zokonzera ma electroplating, yokhala ndi ma response a maola 72.

Kukonza njira zogwirira ntchito komanso kupeza zinthu zambiri kumachepetsa mitengo ya foil yopangidwa mwamakonda ndi 15–20% poyerekeza ndi avareji yamsika.

Kuyambira pa ma ingot a millimeter mpaka ma foil owonda ngati micron, kupanga ma foil a mkuwa ozungulira ndi kuvina kwa sayansi ya zinthu ndi uinjiniya wolondola. Pamene kusintha kwa 5G ndi mphamvu kukupitirira, makampani okhawo omwe amaphatikiza kulondola kokhazikika ndi kusintha kwakukulu ndi omwe angapitirire patsogolo.CHITSULO CHA CIVENakuyendetsa kusinthaku, kuthandiza Chinapepala la mkuwaMakampani akukwera unyolo wamtengo wapatali padziko lonse lapansi.