[RTF] Reverse Anachitira ED Copper Chojambula
Chiyambi cha Zamalonda
RTF, chojambula chamkuwa chopangidwa ndi electrolytic ndi chojambula chamkuwa chomwe chakhala roughened mosiyanasiyana mbali zonse.Izi zimalimbitsa mphamvu ya peel ya mbali zonse ziwiri za zojambulazo zamkuwa, zomwe zimapangitsa kuti zikhale zosavuta kugwiritsa ntchito ngati wosanjikiza wapakati polumikizana ndi zida zina.Komanso, milingo yosiyanasiyana ya chithandizo kumbali zonse ziwiri za zojambula zamkuwa zimapangitsa kuti zikhale zosavuta kuyika mbali yowonda kwambiri ya wosanjikiza wowuma.Popanga gulu losindikizidwa la dera (PCB), mbali yothandizidwa ndi mkuwa imagwiritsidwa ntchito kuzinthu za dielectric.Mbali ya ng'oma yokhala ndi mankhwala ndi yolimba kuposa mbali inayo, yomwe imapanga kumamatira kwakukulu kwa dielectric.Uwu ndiye mwayi waukulu kuposa mkuwa wa electrolytic.Mbali ya matte safuna chithandizo chamankhwala kapena mankhwala musanagwiritse ntchito photoresist.Ndi kale akhakula mokwanira kukhala zabwino laminating kukana adhesion.
Zofotokozera
CIVEN ikhoza kupereka RTF electrolytic copper zojambulazo ndi makulidwe mwadzina a 12 mpaka 35µm mpaka 1295mm m'lifupi.
Kachitidwe
Kutalikirana kwa kutentha kwambiri komwe kumasinthidwa ndi chojambula chamkuwa chopangidwa ndi electrolytic chimayikidwa m'ndondomeko yolondola kuti athe kuwongolera kukula kwa zotupa zamkuwa ndikuzigawa mofanana.Kusinthidwa kowala kowoneka bwino kwa zojambulazo zamkuwa kumatha kuchepetsa kuuma kwa zojambulazo zamkuwa zopanikizidwa pamodzi ndikupereka mphamvu yokwanira ya peel ya zojambulazo zamkuwa.(Onani Gulu 1)
Mapulogalamu
Itha kugwiritsidwa ntchito pazogulitsa zothamanga kwambiri komanso ma laminate amkati, monga masiteshoni a 5G ndi radar yamagalimoto ndi zida zina.
Ubwino wake
Mphamvu yabwino yolumikizana, kuwongolera kwamitundu yambiri, komanso magwiridwe antchito abwino.Komanso amachepetsa kuthekera kwa dera lalifupi ndi kufupikitsa ndondomeko mkombero nthawi.
Table 1. Magwiridwe
Gulu | Chigawo | 1/3 OZ (12μm) | 1/2 OZ (18μm) | 1 oz (35μm) | |
Cu Content | % | min.99.8 | |||
Kulemera kwa Malo | g/m2 | 107±3 | 153 ± 5 | 283 ± 5 | |
Kulimba kwamakokedwe | RT(25℃) | Kg/mm2 | min.28.0 | ||
HT(180 ℃) | min.15.0 | min.15.0 | min.18.0 | ||
Elongation | RT(25℃) | % | min.5.0 | min.6.0 | min.8.0 |
HT(180 ℃) | min.6.0 | ||||
Ukali | Wonyezimira (Ra) | μm | max.0.6/4.0 | max.0.7/5.0 | max.0.8/6.0 |
Matte (Rz) | max.0.6/4.0 | max.0.7/5.0 | max.0.8/6.0 | ||
Peel Mphamvu | RT(23℃) | Kg/cm | min.1.1 | min.1.2 | min.1.5 |
Kutsika kwa HCΦ(18% -1hr/25 ℃) | % | max.5.0 | |||
Kusintha kwa mtundu(E-1.0hr/190 ℃) | % | Palibe | |||
Solder Yoyandama 290 ℃ | Sec. | max.20 | |||
Pinhole | EA | Zero | |||
Preperg | ---- | FR-4 |
Zindikirani:1. Mtengo wa Rz wa zojambula zamkuwa ndi mtengo wokhazikika woyezetsa, osati mtengo wotsimikizika.
2. Peel mphamvu ndi muyezo wa FR-4 board test value (5 mapepala a 7628PP).
3. Nthawi yotsimikizira zaubwino ndi masiku 90 kuyambira tsiku lomwe adalandira.