[VLP] Mbiri Yotsika Kwambiri ED Copper Foil
![[VLP] Mbiri Yotsika Kwambiri ya ED Copper Foil Yowonetsedwa](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Chiyambi cha Zamalonda
VLP, chojambula chotsika kwambiri cha electrolytic copper chopangidwa ndi CIVEN METAL chili ndi mawonekedwe amphamvu otsika komanso kulimba kwa peel. The zojambulazo mkuwa opangidwa ndi ndondomeko electrolysis ali ndi ubwino mkulu chiyero, zosafunika otsika, pamwamba yosalala, lathyathyathya bolodi mawonekedwe, ndi lalikulu m'lifupi. Chojambula chamkuwa cha electrolytic chikhoza kupangidwa bwino ndi zipangizo zina mutatha kukwiyitsa mbali imodzi, ndipo sizovuta kuzichotsa.
Zofotokozera
CIVEN imatha kupereka mawonekedwe otsika kwambiri a kutentha kwa ductile electrolytic copper foil (VLP) kuchokera pa 1/4oz mpaka 3oz (mwadzina makulidwe 9µm mpaka 105µm), ndipo kukula kwake kwakukulu ndi 1295mm x 1295mm pepala lamkuwa zojambulazo.
Kachitidwe
CIVEN imapereka zojambulazo zamkuwa za electrolytic zolimba kwambiri zokhala ndi mawonekedwe abwino kwambiri a equiaxial fine crystal, mbiri yotsika, mphamvu yayikulu komanso kutalika kwambiri. (Onani Gulu 1)
Mapulogalamu
Zogwiritsidwa ntchito popanga matabwa amagetsi apamwamba kwambiri komanso ma board othamanga kwambiri pamagalimoto, mphamvu zamagetsi, kulumikizana, zankhondo ndi zakuthambo.
Makhalidwe
Kuyerekeza ndi zinthu zakunja zofanana.
1.Mapangidwe a njere a VLP yathu ya electrolytic copper zojambulazo ndi equiaxed fine crystal spherical; pomwe kapangidwe kambewu kazinthu zakunja kofananira ndi kolala komanso kutalika.
2. Electrolytic mkuwa zojambulazo ndi ultra-otsika mbiri, 3oz mkuwa zojambulazo gross pamwamba Rz ≤ 3.5µm; pomwe zinthu zakunja zofananira ndi mbiri yokhazikika, 3oz copper zojambulazo gross surface Rz> 3.5µm.
Ubwino wake
1.Popeza mankhwala athu ndi otsika kwambiri, amathetsa chiwopsezo chomwe chingakhale chamzere wachidule chifukwa cha kuuma kwakukulu kwa zojambulazo zamkuwa zakuda komanso kulowa mosavuta kwa pepala lopyapyala ndi "dzino la nkhandwe" mukakanikiza gulu la mbali ziwiri.
2.Chifukwa chakuti kapangidwe kake kazinthu zathu ndi kofanana ndi kristalo wabwino wozungulira, amafupikitsa nthawi yokhotakhota ndikuwongolera vuto la mizere yosagwirizana.
3, pokhala ndi mphamvu zambiri za peel, palibe kusuntha kwa ufa wamkuwa, zojambula zomveka bwino za PCB.
Magwiridwe(GB/T5230-2000,IPC-4562-2000)
| Gulu | Chigawo | 9 mm | 12m mu | 18m mu | 35m mu | 70m mu | 105mm | |
| Cu Content | % | ≥99.8 | ||||||
| Kulemera kwa Malo | g/m2 | 80 ±3 | 107±3 | 153 ± 5 | 283 ± 7 | 585 ± 10 | 875 ± 15 | |
| Kulimba kwamakokedwe | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180 ℃) | ≥15 | ≥18 | ≥20 | |||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180 ℃) | ≥6.0 | ≥8.0 | ||||||
| Ukali | Wonyezimira (Ra) | μm | ≤0.43 | |||||
| Matte (Rz) | ≤3.5 | |||||||
| Peel Mphamvu | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Kutsika kwa HCΦ(18% -1hr/25 ℃) | % | ≤7.0 | ||||||
| Kusintha kwa mtundu (E-1.0hr/200 ℃) | % | Zabwino | ||||||
| Solder Yoyandama 290 ℃ | Sec. | ≥20 | ||||||
| Maonekedwe (Mawanga ndi ufa wamkuwa) | ---- | Palibe | ||||||
| Pinhole | EA | Zero | ||||||
| Kulekerera Kukula | M'lifupi | mm | 0 ~ 2 mm | |||||
| Utali | mm | ---- | ||||||
| Kwambiri | Mm/inchi | Mkati Diameter 79mm / 3 inchi | ||||||
Zindikirani:1. Mtengo wa Rz wa zojambula zamkuwa ndi mtengo wokhazikika woyezetsa, osati mtengo wotsimikizika.
2. Peel mphamvu ndi muyezo wa FR-4 board test value (5 mapepala a 7628PP).
3. Nthawi yotsimikizira zaubwino ndi masiku 90 kuyambira tsiku lomwe adalandira.
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