[VLP] Foil ya ED Copper Foil Yotsika Kwambiri
![[VLP] Chithunzi Chojambulidwa cha ED Copper Foil Chotsika Kwambiri](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Chiyambi cha Zamalonda
Chojambula cha mkuwa cha VLP, chopangidwa ndi CIVEN METAL, chili ndi mawonekedwe otsika kwambiri komanso mphamvu yayikulu yoboola. Chojambula cha mkuwa chomwe chimapangidwa ndi njira ya electrolysis chili ndi ubwino wa kuyera kwambiri, kusayera pang'ono, malo osalala, mawonekedwe a bolodi lathyathyathya, komanso m'lifupi mwake. Chojambula cha mkuwa cha electrolytic chingathe kupakidwa bwino ndi zipangizo zina pambuyo poboola mbali imodzi, ndipo sikophweka kuchotsa.
Mafotokozedwe
CIVEN ikhoza kupereka foil yamkuwa yopangidwa ndi electrolytic copper foil (VLP) yolemera kwambiri (ultra-low profile high temperature ductile electrolytic copper foil) kuyambira 1/4oz mpaka 3oz (nominal thickness 9µm mpaka 105µm), ndipo kukula kwakukulu kwa chinthucho ndi 1295mm x 1295mm sheet copper foil.
Magwiridwe antchito
CIVEN imapereka foil yamkuwa yokhuthala kwambiri yokhala ndi mawonekedwe abwino kwambiri a kristalo wosalala wa equiaxial, mawonekedwe otsika, mphamvu yayitali komanso kutalika kwakukulu. (Onani Gome 1)
Mapulogalamu
Imagwiritsidwa ntchito popanga ma board amagetsi amphamvu kwambiri komanso ma board amagetsi amphamvu kwambiri a magalimoto, magetsi, kulumikizana, asilikali ndi ndege.
Makhalidwe
Kuyerekeza ndi zinthu zofanana zakunja.
1. Kapangidwe ka tirigu wa VLP electrolytic copper foil yathu ndi yozungulira ngati kristalo; pomwe kapangidwe ka tirigu wa zinthu zofanana zakunja ndi kolala komanso yayitali.
2. Foyilo yamkuwa ya electrolytic ndi yotsika kwambiri, pamwamba pake pali 3oz ya foyilo yamkuwa ≤ 3.5µm; pomwe zinthu zofanana zakunja ndi zokhazikika, pamwamba pake pali 3oz ya foyilo yamkuwa ≤ 3.5µm.
Ubwino
1. Popeza malonda athu ndi otsika kwambiri, amathetsa chiopsezo cha mzere waufupi chifukwa cha kukhwima kwakukulu kwa pepala lolimba la mkuwa komanso kulowa mosavuta kwa pepala lopyapyala loteteza ndi "dzino la nkhandwe" mukakanikiza gulu la mbali ziwiri.
2. Popeza kapangidwe ka tirigu wa zinthu zathu ndi kozungulira ngati galasi, kamafupikitsa nthawi yocheka mzere ndikuwonjezera vuto la kudula mbali ya mzere wosagwirizana.
3, ngakhale kuti ili ndi mphamvu zambiri zokoka, palibe ufa wa mkuwa wosuntha, zithunzi zomveka bwino za PCB zomwe zimagwira ntchito.
Magwiridwe antchito (GB/T5230-2000、IPC-4562-2000)
| Kugawa | Chigawo | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Zamkati mwa Cu | % | ≥99.8 | ||||||
| Kulemera kwa Dera | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Kulimba kwamakokedwe | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Kutalikitsa | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Kuuma | Wonyezimira(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Mphamvu Yopukuta | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Kuchepa kwa HCΦ (18%-1hr/25℃) | % | ≤7.0 | ||||||
| Kusintha kwa mtundu (E-1.0hr/200℃) | % | Zabwino | ||||||
| Solder Yoyandama 290℃ | Sek. | ≥20 | ||||||
| Maonekedwe (malo ndi ufa wa mkuwa) | ---- | Palibe | ||||||
| Bowo la Pinhole | EA | Zero | ||||||
| Kulekerera Kukula | M'lifupi | mm | 0 ~ 2mm | |||||
| Utali | mm | ---- | ||||||
| Kore | Mm/inchi | Mkati mwake 79mm/3 inchi | ||||||
Zindikirani:1. Mtengo wa Rz wa pamwamba pa pepala la mkuwa ndi mtengo wokhazikika woyeserera, osati mtengo wotsimikizika.
2. Mphamvu ya peel ndi mtengo woyesera wa bolodi la FR-4 (mapepala 5 a 7628PP).
3. Nthawi yotsimikizira khalidwe ndi masiku 90 kuyambira tsiku lolandira.
![[HTE] Foyilo Yaikulu Kwambiri ya ED Copper](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Batri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[RTF] Chojambula Chopangidwa ndi Mkuwa cha ED Chosinthidwa](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
